Singh, Sundeep, et al. “Numerical Modeling and Simulation of Non-Invasive Acupuncture Therapy Utilizing Near-Infrared Light-Emitting Diode”. Bioengineering, vol. 10, no. 7, 2023, p. 837, https://doi.org/10.3390/bioengineering10070837.

Genre

  • Journal Article
Contributors
Author: Singh, Sundeep
Author: Xu, Chang-Qing
Author: Wang, Zexi
Author: Zhang, Zhiyi
Author: Ramful, Chundra
Author: Escobar, Andres
Date Issued
2023
Date Published Online
2023-07-15
Abstract

Acupuncture is one of the most extensively used complementary and alternative medicine therapies worldwide. In this study, we explore the use of near-infrared light-emitting diodes (LEDs) to provide acupuncture-like physical stimulus to the skin tissue, but in a completely non-invasive way. A computational modeling framework has been developed to investigate the light-tissue interaction within a three-dimensional multi-layer model of skin tissue. Finite element-based analysis has been conducted, to obtain the spatiotemporal temperature distribution within the skin tissue, by solving Pennes' bioheat transfer equation, coupled with the Beer-Lambert law. The irradiation profile of the LED has been experimentally characterized and imposed in the numerical model. The experimental validation of the developed model has been conducted through comparing the numerical model predictions with those obtained experimentally on the agar phantom. The effects of the LED power, treatment duration, LED distance from the skin surface, and usage of multiple LEDs on the temperature distribution attained within the skin tissue have been systematically investigated, highlighting the safe operating power of the selected LEDs. The presented information about the spatiotemporal temperature distribution, and critical factors affecting it, would assist in better optimizing the desired thermal dosage, thereby enabling a safe and effective LED-based photothermal therapy.

Language

  • English
Rights
CC-BY
Funding Note
National Research Council (NRC) Canada
Page range
837
Host Title
Bioengineering
Host Abbreviated Title
Bioengineering
Volume
10
Issue
7
ISSN
2306-5354

Rights

  • CC BY